EPG4001AS-RC Datasheet | PCA ELECTRONICS

.. 1000Base-T Module ELECTRONICS INC. EPG4001AS & EPG4001AS-RC - plies with or exceeds IEEE 802.3ab 1000Base-T - Guaranteed to operate with 10/100Base-TX - 1500 Vrms Isolation - Ro HS pliant Electrical Parameters @ 25° C OCL (µH Min.) @ 100 KHz, 0.1 Vrms 8 m A DC bias 350 (Media Side) 1-65 MHz -1 Insertion Loss (d B Max.) 65-100 MHz -1.1 100-125 MHz -1.5 1-40 MHz -18 Return Loss (d B Min.) 60 MHz -15 80 MHz -12 100 MHz -10 CMRR (d B Min.) 1-80 MHz -30 mon to Differential (d B Min.) 1 MHz -60 30 MHz -40 50 MHz -35 100 MHz -30 1-40 MHz -40 Crosstalk (d B Min.) 60 MHz -35 100 MHz -30 - Rise Time : 1.75 n S Max. - Impedance : 100 Ω - Package .690 (17.53) .070 (1.78) PCA EPG4001AS-RC Date Code Schematic 1, 4, 7, 10 .050 (1.27) Pad Layout .090 (2.29) 2, 5, 8, 11 1CT:1CT 24, 21, 18, 15 23, 20, 17, 14 .480 (12.19) .670 (17.02) 3, 6, 9, 12 22, 19, 16, 13 Pin 1 I.D. .550 (13.97) .260 (6.60) .010/.015 (.254/.381) 0°-8° .030 (.762) .008/.013 (.203/.305) .035 (.889) .016/.022 (.406/.559) .050 ((1.27) .600 (15.24) Notes : 1. Assembly Process (Solder position) EPG4001AS (Lead Frame Finish) (Assembly Solder) Sn Pb Sn Pb 225°C (+0/-5°C) (168 Hours, ≤30°C/60%RH) EPG4001AS-RC Sn or Sn AG Sn Pb [Ro HS Exemption 7a] 260°C (+0°C) (72 Hours, ≤30°C/60%RH) 2. Peak Solder Rating (per IPC/JEDEC J-STD-020C) 3. Moisture Sensitive Levels (MSL) (per IPC/JEDEC J-STD-020C) 4. Weight 5. Packaging Information (Tube) (Tape & Reel) 3.35 grams 30 pieces 350 pieces/13” reel (- EPG4001AS-TR) 3.35 grams 30 pieces 350 pieces/13” reel (- EPG4001AS-RCTR)...