1SMB3EZ160 Datasheet | Pan Jit International Inc.

FEATURES l For surface mounted applications in order to optimize board space l Low profile package l Built-in strain relief l l l l l l Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammability Classification 94V-O DO-214AA MODIFIED J-BEND MECHANICAL DATA Case: JEDEC DO-214AA, Molded plastic over passivated junction Terminals: Solder plated, solderable per MIL-STD-750, method 2026 Polarity: Color band denotes positive end (cathode) except Bidirectional Standard Packaging: 12mm tape(EIA-481) Weight: 0.003 ounce, 0.093 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ¢J ambient temperature unless otherwise specified. SYMBOL Peak Pulse Power Dissipation (Note A) PD Derate above 75 ¢J Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated IFSM load(JEDEC Method) (Note B) Operating Junction and Storage Temperature Range TJ,TSTG NOTES: 2 A. Mounted on 5.0mm (.013mm thick) land areas. B. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum. VALUE 3 24 15 -55 to +150 UNITS Watts m W/¢J Amps ¢J 1SMB3EZ11 THRU 1SMB3EZ200 ELECTRICAL CHARACTERISTICS (T A=25 ¢J unless otherwise noted) VF=1.2 V max , IF=500 m A for all types Type No. (Note 1.) Nominal Test Zener Voltage current Maximum Zener Impedance Vz @ IZT IZT (Note 3.) volts m A Z ZT @ IZT ZZk @ IZK IZK (Note 2.) Ohms Ohms m A Leakage Current IR £g A Max @ VR Volts Maximum Surge Zener Current Current @ TA = 25 ¢J IZM ir - m A Madc (Note 4.) 225 246 208 193 180 169 150 159 142 135 123 112 100 96 90 82 75 69 63 57 53 48 44 40 36 33 30 27 25 22 21 19 18 17 16 15 14 13 1.82 1.66 1.54 1.43 1.33 1.25 1.18 1.11 1.05 1 0.91 0.83 0.74 0.71 0.67 0.61 0.56 0.51 0.45 0.42 0.39 0.36 0.32 0.29 0.27 0.24 0.22 0.2 0.18 0.16 0.15 0.14 0.13 0.12 0.12 0.11 0.1 0.1 Device Marking...