BZX55-C12 Overview
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA
- Case: Molded glass DO-35
- Terminals: Solderable per MIL-STD-202, Method 208
- Polarity: See Diagram Below
- Approx. Weight: 0.13 grams
- Mounting Position: Any
