BZX584C30 Key Features
- Planar Die construction
- 200mW Power Dissipation
- Zener Voltages from 2.4~75V
- Ideally Suited for Automated Assembly Processes
- Pb free product : 99% Sn above can meet RoHS environment substance diective request
- Case: SOD-523, Plastic
- Terminals: Solderable per MIL-STD-750, Method 2026
- Standard packaging : 8mm tape
- Weight : approximately 0.002
