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BZX784B5V6 - SURFACE MOUNT SILICON ZENER DIODES

Datasheet Summary

Features

  • Planar Die construction.
  • 200mW Power Dissipation.
  • Ideally Suited for Automated Assembly Processes.
  • In compliance with EU RoHS 2002/95/EC directives.

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Datasheet Details

Part number BZX784B5V6
Manufacturer Pan Jit International
File Size 99.76 KB
Description SURFACE MOUNT SILICON ZENER DIODES
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BZX784B5V6 SURFACE MOUNT SILICON ZENER DIODES FEATURES • Planar Die construction • 200mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: SOD-723, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Polarity: See Diagram Below • Approx. Weight: 0.00077 gram • Mounting Position: Any MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Maximum Power Dissipation (Notes A) at 25OC Operating Junction and StorageTemperature Range Symbol PD TJ Value 200 -55 to +150 Units mW OC ELECTRICAL CHARACTERISTICS Part Number BZX784B5V6 Nominal Zener Voltage Nom. V 5.6 VZ @ I ZT Min. V 5.49 Max. V 5.71 Max. Zener Impedance ZZT @ I ZT Ω mA 40 5.0 ZZK @ I ZK Ω mA 400 1.00 Max.
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