GS1001FL
Overview
- For surface mounted applications in order to optimize board space
- Low profile package
- Ideal for automated placement
- High temperature soldering : 260°C /10 seconds at terminals
- Glass Passivated Chip Junction
- Lead free in compliance with EU RoHS 2011/65/EU directive
- Green molding compound as per IEC61249 Std. . (Halogen Free)
