MMBD6100 Datasheet | PanJit Semiconductor

Features - Dual, mon cathode configuration - Very fast reverse recovery ( Trr< 2.0ns typical ) - Low capacitance ( < 2.5p F @ 0V) - Surface mount package ideally suited for anuomatic insetion - Lead free in ply with EU Ro HS 2002/95/EC directives. - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA Case: SOT-23 plastic Terminals : Solderable per MIL-STD-750,Method 2026 Approx weight : 0.0084 gram Marking : T4 0.120(3.04) 0.110(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.070(1.80) 0.004(0.10) 0.000(0.00) 0.020(0.50) 0.013(0.35) 0.008(0.20) 0.003(0.08) 0.044(1.10) 0.035(0.90) ABSOLUTE RATINGS PARAMETER Maximum Reverse Voltage Peak Reverse Voltage Continuous Forward Current Non-repetitive Peak Forward Surge Current at t=1.0 µs SYMBOL VR VRRM IF IFSM THERMAL CHARACTERISTICS PARAMETER Power Dissipation (1) Thermal Resistance, Junction to Ambient...