P6SMB27CA
Key Features
- For surface mounted applications in order to optimize board space
- Glass passivated junction
- Low inductance
- Plastic package has Underwriters Laboratory
- High temperature soldering : 260°C /10 seconds at terminals
- Lead free in pliance with EU RoHS 2011/65/EU directives
- Green molding pound as per IEC61249 Std. . (Halogen Free)
- Case:JEDEC DO-214AA ,Molded plastic over passivated junction
- Terminals: Solder plated,solderable per MIL-STD-750,Method 2026
- Polarity : Color band denotes cathode end
