P6SMB8x
Key Features
- For surface mounted applications in order to optimize board space.
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance www.DataSheet4U.com
- Typical ID less than 1.0µA above 10V
- Plastic package has Underwriters Laboratory Fammability Classification 94V-O
- High temperature soldering : 260°C /10 seconds at terminals
- In compliance with EU RoHS 2002/95/EC directives .155(3.94) .130(3.30) .083(2.11) .075(1.91) .185(4.70) .160(4.06) .012(.305) .006(.152) .096(2.44) .083(2.13)
