P6SMB9x Overview
Key Features
- For surface mounted applications in order to optimize board space
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Typical ID less than 1.0µA above 10V
- Plastic package has Underwriters Laboratory Fammability Classification 94V-O
- High temperature soldering : 260°C /10 seconds at terminals
