RS1008FL Overview
Key Features
- For surface mounted applications
- Low profile package
- Ideal for automated placement
- Glass Passivated Chip Junction
- High temperature soldering : 260OC / 10 seconds at terminals
- In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
- Case : JEDEC SOD-123FL, Molded plastic over passivated junction
- Terminals : Solderable per MIL-STD-750, Method 2026
- Standard Packaging : 8mm tape (EIA-481)
- Apporx. Weight: 0.0006 ounce, 0.0172 gram
