P6SMB Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications in order to optimize board space. - Low profile package - Built-in strain relief - Glass passivated junction - Low inductance - Typical ID less than 1.0µA above 10V - Plastic package has Underwriters Laboratory Fammability Classification 94V-O - High temperature soldering : 260°C /10 seconds at terminals - In pliance with EU Ro HS 2002/95/EC directives MECHANICAL DATA - - - - - Case:JEDEC DO-214AA ,Molded plastic over passivated junction Terminals: Solder plated,solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes positive end (cathode) Standard Packaging:12mm tape (EIA-481) Weight: 0.003 ounce, 0.093 gram DEVICES FOR BIPOLAR APPLICATIONS For Bidirectional use C or CA Suffix for types Electrical characteristics apply in both directions. MAXIMUM RATINGS AND CHARACTERISTICS Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz. For Capacitive load derate current by 20%. Rating Peak Pulse Power Dissipation on 10/1000u S waveform (Notes 1,2, Fig.1) Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) (Notes 2,3) Peak Pulse Current on 10/1000us waveform(Note 1)Fig.3 Typical Thermal Resistance Junction to Air (Notes 2) Operating Junction and Storage Temperature Range Symbol PP P M IF S M IP P M RθJ A TJ ,TS T G Value 600 100 see Table 1 60 -55 to +150 Units Watts Amps Amps C/W NOTES: 1. Non-repetitive current pulse, per Fig.3 and derated above T A = 25 O C per Fig. 2. 2. Mounted on 5.0mm 2 (0.13mm thick) land areas. 3. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum. STAD-APR.21.2009 1 PAGE . 1 Free Datasheet http://../ P6SMB SERIES Part N umber UNI BI V R WM Min . V V V BR @ IT Ma x . V IT m A IR @ VRWM U N IµA B IµA V A UNI BI VC @ IPP Marki ng C ode 600W Transient Voltage Suppressor P6SMB6.8 P6SMB6.8A P6SMB7.5 P6SMB7.5A P6SMB8.2 P6SMB8.2A P6SMB9.1...