SB3020ST
SB3020ST is SCHOTTKY BARRIER RECTIFIERS manufactured by PanJit Semiconductor.
FEATURES
- Plastic package has Underwriters Laboratory Flammability Classification 94V-O. Flame Retardant Epoxy Molding pound.
- Exceeds environmental standards of
0.516(13.20) 0.504(12.80)
30 Amperes
0.615(15.60)MAX. 0.520(13.20) 0.504(12.80)
0.402(10.20) 0.385(9.80)
0.185(4.70) 0.169(4.30)
MIL-S-19500/228
- Low power loss, high efficiency.
- Low forward voltage, high current capability
- High surge capacity.
- For use in low voltage,high frequency inverters free wheeling , and polarlity protection applications.
- In pliance with EU Ro HS 2002/95/EC directives
0.118(3.0) MIN. 0.599(15.20) 0.582(14.80)
0.577(14.65) 0.565(14.35) 0.776(19.70) 0.759(19.30)
0.732(18.58) 0.715(18.18)
MECHANICAL DATA
- Case: TO-247S/TO-3PS Molded plastic
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: As marked.
- Standard packaging: Any
- Weight: 0.1932 ounces, 5.4803 grams.
0.071(1.80) 0.055(1.40) 0.095(2.40) 0.078(2.00) 0.050(1.25) 0.037(0.95)
0.166(4.20) 0.149(3.80) 0.579(14.70) 0.563(14.30)
0.103(2.60) 0.090(2.30)
0.025(0.62) 0.014(0.38) 0.223(5.65) 0.206(5.25)
0.223(5.65) 0.206(5.25)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%
PA RA M E TE R M a xi mum Re c ur re nt P e a k Re ve r s e Vo lta g e M a xi mum RMS Vo lta g e M a xi mum D C B lo c k i ng Vo lta g e M a xi mum A ve r a g e F o r wa r d C urr e nt a t T c = 7 5 OC P e a k F o r wa r d S ur g e C ur r e nt : 8 .3 m s s i ng le ha lf s i ne
- wa ve s up e r i m p o s e d o n r a te d lo a d ( J E D E C m e tho d ) M a xi mum F o r wa r d Vo lta g e a t 1 5 A p e r le g M a xi mum D C Re ve r s e C ur r e nt a t Ra te d D C B lo c k i ng Vo lta g e Typ i c a l The r m a l Re s i s ta nc e Op e r a ti ng J unc ti o n Te mp e r a tur e Ra ng e S to r a g e Te m p e ra tur e Ra ng e
NOTE: Both Bonding and Chip...