BD860T Datasheet | PanJit Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-O - For surface mounted applications - Low profile package - Built-in strain relief - High surge capacity - In pliance with EU Ro HS 2002/95/EC directives .307(7.8) .283(7.2) .225(5.7) .209(5.3) .264(6.7) .248(6.3) .098(2.5) .082(2.1) .024(0.6) .016(0.4) 40 to 200 Volts CURRENT 8 Ampere TO-251AB Unit : inch (mm) - Low power loss, High efficiency .063(1.6) .047(1.2) .216(5.5) .200(5.1) PRELIMINARY MECHANICALDATA - Case: TO-251AB molded plastic - Terminals: Solder plated, solderable per MIL-STD-750,Method 2026 - Polarity: As marking - Standard packaging: 16mm tape (EIA-481) - Weight: 0.0104 ounces, 0.297grams. .032(0.8) .012(0.3) .09 .09 (2.3) (2.3) .071(1.8) .051(1.3) .02(0.5) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Resistive or inductive load. PARAMETER Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current ( S e e F i g u r e 1 ) Peak Forward Surge Current :8.3ms single half sine-wave superimposed on rated load(JEDEC method) Maximum Forward Voltage at 8.0A Maximum DC Reverse Current TJ=25O C at Rated DC Blocking Voltage TJ=100O C Typical Thermal Resistance O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a ng e SYMBOL VRRM VRMS VDC I F(AV) IFSM VF IR RθJC TJ , TS T G BD840T BD845T BD850T BD880T BD890T BD8100T BD8150T BD8200T UNITS V V V A...