BZX55-C27 Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA - Case: Molded glass DO-35 - Terminals: Solderable per MIL-STD-202, Method 208 - Polarity: See Diagram Below - Approx. Weight: 0.13 grams - Mounting Position: Any - Ordering information: Suffix :” -35” to order DO-35 Package - Packing information - 2K per Bulk box T/R - 10K per 13" plastic Reel T/B - 5K per horiz. tape & Ammo box 1.02(26.0)MIN. .153(3.9)MAX. 1.02(26.0)MIN. Unit: inch (mm) .020(0.52)TYP. .079(2.0)MAX. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ =25°C unless otherwise noted) Parameter Power Dissipation at Tamb = 25 OC Symbol PTOT Junction Temperature Storage Temperature Range Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. Value 500 175 -65 to +175 Parameter Thermal Resistance Junction to Ambient Air Symbol Rth A Min. -- Forward Voltage at IF = 100m A VF -- Valid provided that leads at a distance of 10 mm from case are kept at ambient temperature. Typ....