BZX784B5V6 Datasheet | PanJit Semiconductor

FEATURES - Planar Die construction - 200m W Power Dissipation - Ideally Suited for Automated Assembly Processes - In pliance with EU Ro HS 2002/95/EC directives MECHANICAL DATA - Case: SOD-723, Molded Plastic - Terminals: Solderable per MIL-STD-750, Method 2026 - Polarity: See Diagram Below - Approx. Weight: 0.00077 gram - Mounting Position: Any MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Maximum Power Dissipation (Notes A) at 25OC Operating Junction and Storage Temperature Range Symbol PD TJ Value 200 -55 to +150 Units m W OC ELECTRICAL CHARACTERISTICS Part Number BZX784B5V6 Nominal Zener Voltage Nom. V 5.6 VZ @ I ZT Min. V 5.49 Max. V 5.71 Max. Zener Impedance ZZT @ I ZT Ω m A 40 5.0 ZZK @ I ZK Ω m A 400 1.00 Max. Reverse Leakage Current I R @ VR µA V 1.0 2.0 Marking Code NOTES: A. Mounted on 5.0mm2(.013mm thick) land areas. REV.0.1-OCT.30.2008 PAGE . 1 POWER DISSIPATION, Watts TEMPERATURE COEFFICIENT,(m A/OC) 0.6 0.5 TA=25OC 0.4 0.2 0.1 0 0 25 50...