FR3D Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications - Low profile package - Built-in strain relief - Easy pick and place - Fast Recovery times for high efficiency - Plastic package has Underwriters Laboratory Flammability Classification 94V-O - Glass passivated junction - High temperature soldering : 260°C /10 seconds at terminals - In pliance with EU Ro HS 2002/95/EC directives MECHANICAL DATA - Case: JEDEC DO-214AB molded plastic - Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 - Polarity: Indicated by cathode band - Standard packaging: 16mm tape (EIA-481) - Weight: 0.0082 ounce, 0.2325 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. PA RA ME TE R Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Rectified Current at TL=75 O C Peak Forward Surge Current :8.3ms single half sine-wave superimposed on rated load(JEDEC method) Maximum Forward Voltage at 3.0A Maximum DC Reverse Current TJ=25OC at Rated DC Blocking Voltage TJ=125OC Ma xi mum Re ve rs e Re c o ve ry Ti me (No te 1 ) Maximum Junction capacitance (Note 2) Typ i c a l J unc ti o n Re s i s ta nc e (No te 3 ) Op e ra ti ng J unc ti o n a nd S to ra g e Te m p e ra ture Ra ti ng S YMB OL F R3 A VRRM VRMS VDC 50 35 50 IF ( A V ) IF S M V IR trr CJ R θJ L TJ,TS TG FR3B FR3D 100 200 70 140 100 200 FR3G 400 280 400 1.3 1.0 200 150 60 15 -50 to +150 FR3J 600 420 600 UNITS V V V A V µA 250 ns p F OC / W...