GS1001FL Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications in order to optimize board space - Low profile package - Ideal for automated placement - High temperature soldering : 260°C /10 seconds at terminals - Glass Passivated Chip Junction - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA - Case: SOD-123FL,Molded plastic over passivated junction - Terminals: Solderable per MIL-STD-750, Method 2026 - Approx. Weight: 0.0006 ounces, 0.0173grams - Standard Packaging : 8mm tape (EIA-481) - Polarity : Color band cathode 0.075(1.90) 0.067(1.70) 0.044(1.10) 0.031(0.80) 0 . 11 5 ( 2 . 9 0 ) 0.106(2.70) 0.145(3.70) 0.137(3.50) 0.030(0.75) 0.017(0.45) 0.008(0.20) 0.004(0.10) 0.043(1.08) 0.038(0.98) Cathode Anode MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. PARAMETER SY MBOL GS1000FL GS1001FL GS1002FL GS1004FL GS1006FL GS1010FL UNITS Marking Code 1A 1B 1D 1G 1J 1M Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage VRRM VRMS VDC 50 35 50 70 140 280 420 700 V Maximum Average Forward Current (Note 1) 1A F(AV) Peak One Cycle Surge Forward Current (non-repetitive)...