GS1010HE Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications in order to optimize board space - Ideal for automated placement - High temperature soldering : 260°C /10 seconds at terminals - Glass Passivated Chip Junction - Lead free in ply with EU Ro HS 2011/65/EU directives - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA - Case: SOD-123HE, Molded plastic over passivated junction - Terminals: Solderable per MIL-STD-750, Method 2026 - Approx. Weight: 0.0001 ounce, 0.0042 gram - Standard Packaging: 8mm tape (EIA-481) - Polarity: Color band denotes cathode end 0.046(1.15) 0.033(0.85) 0 . 11 4 ( 2 . 9 0 ) 0.106(2.70) 0.040(1.00) 0.031(0.80) 0.154(3.90) 0.137(3.50) 0.012(0.30) 0.007(0.20) 0.091(2.30) 0.074(1.90) 0.048(1.20) 0.031(0.80) Cathode Anode MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25o C unless otherwise noted) Marking Code PARAMETER S YMB OL GS 1 0 0 4 HE GS 1 0 0 6 HE GS 1 0 0 8 HE GS 1 0 1 0 HE UNITS - H1G H1J H1K H1M - Maxi mum Recurrent Peak Reverse Voltage Maxi mum RMS Voltage Maxi mum D C Blocki ng Voltage Maxi mum Average Forward C urrent Peak Forward Surge Current : 8.3ms single half sinewave superimposed on rated load Maxi mum Forward Voltage at 1A Maxi mum D C Reverse C urrent at Rated DC Blocking Voltage V RRM V RMS...