GS2008HE Datasheet | PanJit Semiconductor

FEATURES - For surface mounted applications - Low profile package - Ideal for automated placement - Glass Passivated Chip Junction - Lead free in ply with EU Ro HS 2011/65/EU directives. - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA - Case: SOD-123HE, Molded plastic over passivated junction - Terminals: Solder plated, solderable per MIL-STD-750,Method 2026 - Approx. Weight: 0.0001 ounce, 0.0042 gram - Standard Packaging : 8mm tape (EIA-481) - Polarity : Color band denotes cathode end 0.046(1.15) 0.033(0.85) 0 . 11 4 ( 2 . 9 0 ) 0.106(2.70) 0.040(1.00) 0.031(0.80) 0.154(3.90) 0.137(3.50) 0.012(0.30) 0.007(0.20) 0.091(2.30) 0.074(1.90) 0.048(1.20) 0.031(0.80) Cathode Anode MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. PA RA ME TE R S YMB OL GS 2 0 0 4 HE GS 2 0 0 6 HE GS 2 0 0 8 HE UNITS Marking Code - 4H 6H 8H - Maxi mum Recurrent Peak Reverse Voltage V RRM Maxi mum RMS Voltage V RMS Maxi mum DC Blocki ng Voltage V DC Ma xi mum A ve rag e Forwa rd C urrenth at TL=100 OC Peak Forward Surge Current : 8.3ms single half sine-wave superimposed on rated load(JEDEC method) Maxi mum Forward Voltage at...