GV806B Datasheet | PanJit Semiconductor

Features - For surface mounted applications in order to optimize board space - Ultra thin profile package for space constrained utilization - Easy pick and place package suitable for automated handling - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) Mechanical Data - Case: TO-277B package - Terminals: solder plated, solderable per MIL-STD-750,Method 2026 - Weight: 0.0038 ounces, 0.109 grams - Marking: Part number TOP VIEW 0.136(3.45) 0.128(3.25) 0.085(2.15) 0.076(1.95) 0.048(1.20) 0.039(1.00) 0.172(4.35) 0.167(4.25) 0.243(6.15) 0.238(6.05) 0.282(7.15) 0.269(6.85) 0.052(1.30) 0.044(1.10) 0.083(2.10) 0.193(4.90) 0.181(4.60) 0.053(1.35) 0.045(1.15) 0.014(0.35) 0.009(0.25) Maximum Ratings And Electrical Characteristics o (TA=25 C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum rms voltage Maximum dc blocking voltage Maximum average forward rectified current Peak forward surge current : 8.3ms single half sinewave superimposed on rated load Maximum forward voltage at 8A Maximum dc reverse current at rated dc blocking voltage Typical junction capacitance Measure at 1MHz and applied VR=4V Typical thermal resistance (Note 1) (Note 2) Operating junction temperature range Storage temperature range SYMBOL GV804B GV806B GV808B GV810B...