MMBD7000 Datasheet | PanJit Semiconductor

FEATURES - Very fast reverse recovery (Trr < 2 ns typical) - Isolated, series-connected diode pair - Surface mount package ideally suited for automatic insertion - Lead free in pliance with EU Ro HS 2.0 - Green molding pound as per IEC 61249 standard MECHANICAL DATA Case : SOT-23, Plastic Terminals : Solderable per MIL-STD-750, Method 2026 Approx. Weight : 0.0084 grams 0.120(3.04) 0.110(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.070(1.80) 0.004(0.10) 0.000(0.00) 0.020(0.50) 0.013(0.35) 0.008(0.20) 0.003(0.08) 0.044(1.10) 0.035(0.90) 0.006(0.15)MIN. ABSOLUTE RATINGS Parameter Maxi mum Reverse Voltage Peak Reverse Voltage Continuous F orward C urrent Non-repetiti ve P eak Forward Surge C urrent at t=1s THERMAL CHARACTERISTICS Parameter Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) J unc t i o n Te mp e ra t ur e S t o ra g e Te m p e ra t ure Note 1. FR-4 Boand = 70 x 60 x 1mm. S ymb o l VR V RRM IF I FSM S ym b o l P TOT RJA TJ TSTG Value 100 100 0.2 4 Uni ts V V A A Value 225 556 -55 to 150 -55 to 150 Uni ts m W OC /W OC OC SERIES April 28,2023 MMBD7000-REV.00 PAGE . 1 ELECTRICAL CHARACTERISTICS Parameter Reverse Breakdown Voltage Reverse Current Forward Voltage Total Capacitance Reverse Recovery Time (See Figure 1) Symbol VBR...