MMBD701 Datasheet | PanJit Semiconductor

FEATURES - Extremely low minority carrier lifetime - Low capacitance (0.4p F @ 20V typical) - Low reverse leakage (30n A @ 35V typical) - Surface mount package ideally suited for automatic insertion - Lead free in ply with EU Ro HS 2002/95/EC directives. - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA - Case: SOT-23 plastic case. - Terminals : Solderable per MIL-STD-750,Method 2026 - Weight: approximately 0.0084 gram 0.120(3.04) 0.110(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.070(1.80) 0.004(0.10) 0.000(0.00) 0.020(0.50) 0.013(0.35) 0.008(0.20) 0.003(0.08) 0.044(1.10) 0.035(0.90) MAXIMUM RATINGS AND THERMAL CHARACTERISTICS Parameter Marking Code Reverse Voltage Peak Reverse Voltage Maximum Forward Current Power Dissipation (1) Thermal Resistance , Junction to Ambient (1) Junction Temperature Range Storage Temperature Range Symbol VR VRRM IF Pto t RθJ...