SVM1045V2 Datasheet | PanJit Semiconductor

FEATURES - Ideal for automated placement - Low f orward voltage drop, low power los ses - High efficiency Operation 0.243(6.15) 0.238(6.05) 0.014(0.35) 0.009(0.25) 0.172(4.35) 0.167(4.25) 0.048(1.20) 0.039(1.00) 45 Volts CURRENT 10 Amperes - Low thermal resistance - Ultra thin profile package for space constrained utilization - Package suitable for automated handling - Lead free in ply with EU Ro HS 2002/95/EC directives. - Green molding pound as per IEC61249 Std. . (Halogen Free) 0.128(3.25) 0.085(2.15) 0.262(6.65) 0.250(6.35) 0.052(1.30) 0.044(1.10) 0.083(2.10) 0.076(1.95) MECHANICAL DATA Case : TO-277, Plastic Terminals : Solderable per MIL-STD-750, Method 2026 Weight: 0.0037 ounces, 0.1073 grams Marking:SVM1045V2 0.136(3.45) 0.183(4.65) 0.171(4.35) 0.043(1.10) 0.035(0.90) http://..net/ MAXIMUM RATINGS(T A=25o C unless otherwise noted) PARAMETER Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Rectified Output Current Peak Forward Surge Current:8.3ms single half sine-wave superimposed on rated load (JEDEC method) Typ i c a l Junc ti o n c a p a ci t a nce Typical Thermal Resistance ,Junction to Ambient Junction to Case V R = 4 V,1 MH Z (Note 2) (Note 1) SYMBOL VRRM VRMS VR I F(AV) I FSM CJ RJA RJC TJ,TSTG VALUE 45 32 45 10 275 860 110 13 -55 to + 150 o UNIT V V V A A p F C/W o Operating junction temperature range and Storage temperature range NOTES: 1.Mounted on an FR4 PCB, s ingle-sided c opper, with 100c m c opper pad area. 2.Mounted on an FR4 PCB, single-sided copper, mini pad. January 03,2013-REV.00 PAGE . 1 datasheet pdf - http://..net/ ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted) PARAMETER Breakdown voltage SYMBOL VBR TEST CONDITIONS I R=0.5m A I F=1A I F=5A I F=10A I F=1A I F=5A I F=10A VR=36V Reverse current IR VR=45V TA=25o C TA=25 o C MIN. 45 TYP. 0.28 0.36 0.41 0.18 0.28 0.36 70 35 MAX. 0.44 220 UNIT V V o Instantaneous forward voltage TA=125o C TA=25...