SVM1060XB Datasheet | PanJit Semiconductor

FEATURES - Ideal for automated placement - Extreme low forward voltage drop, low power losses - High efficiency Operation - Low thermal resistance - Ultra thin profile package for space constrained utilization - Package suitable for automated handling - Lead free in ply with EU Ro HS 2011/65/EU directives. - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA Case : TO-277B, Plastic Terminals : Solderable per MIL-STD-750, Method 2026 Weight : 0.0038 ounces, 0.1088 grams Marking : SVM1060XB 0.136(3.45) 0.128(3.25) 0.085(2.15) 0.076(1.95) 0.048(1.20) 0.039(1.00) 0.172(4.35) 0.167(4.25) 0.243(6.15) 0.238(6.05) 0.282(7.15) 0.269(6.85) 0.052(1.30) 0.044(1.10) 0.083(2.10) 0.193(4.90) 0.181(4.60) 0.053(1.35) 0.045(1.15) 0.014(0.35) 0.009(0.25) MAXIMUM RATINGS(TA=25o C unless otherwise noted) PARAMETER Maximum Recurrent Peak Reverse Voltage SYMBOL VRRM Maximum RMS Voltage VRMS Maximum DC Blocking Voltage Maximum Average Rectified Output Current I F(AV) Peak Forward Surge Current : 8.3ms single half sine-wave superimposed on rated load (JEDEC method) I FSM Typical Junction Capacitance Typical Thermal Resistance ,Junction to Ambient Junction to Case V R=4 V,1 M H Z (Note 2) (Note 1) RJA RJC Operating junction temperature range and Storage temperature...