SVM860UB Datasheet | PanJit Semiconductor

FEATURES - Ideal for automated placement - Extreme low forward voltage drop, low power loss - High efficiency operation - Low thermal resistance - Ultra Thin Profile Package for Space Constrained Utilization - Package suitable for Automated Handling - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) MECHANICAL DATA Case : TO-277B, Plastic Terminals : Solderable per MIL-STD-750, Method 2026 Weight : 0.0038 ounces, 0.1088 grams Marking : Part number 0.136(3.45) 0.128(3.25) 0.085(2.15) 0.076(1.95) 0.048(1.20) 0.039(1.00) 0.172(4.35) 0.167(4.25) 0.243(6.15) 0.238(6.05) 0.282(7.15) 0.269(6.85) 0.052(1.30) 0.044(1.10) 0.083(2.10) 0.193(4.90) 0.181(4.60) 0.053(1.35) 0.045(1.15) 0.014(0.35) 0.009(0.25) MAXIMUM RATINGS (TA=25o C unless otherwise noted) PARAMETER Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Rectified Output Current Peak Forward Surge Current : 8.3ms single half sine-wave superimposed on rated load Typical Thermal Resistance, Junction to Case Junction to Ambient Operating Junction Temperature and Storage Temperature range SYMBOL VRRM VRMS I F(AV) (Note 1) (Note 1) I FSM RΘJC RΘJA TJ,TSTG VALUE...