SVT15150VB Datasheet | PanJit Semiconductor

Features - Ideal for automated placement - Ultra low forward voltage drop, low power loss - High efficiency operation - Low thermal resistance - Ultra thin profile package for space constrained utilization - Easy pick and place package suitable for automated handling - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) Mechanical Data - Case: TO-277B package - Terminals: solder plated, solderable per MIL-STD-750,Method 2026 - Weight: 0.0038 ounces, 0.1088 grams. - Marking: Part number 0.136(3.45) 0.128(3.25) 0.085(2.15) 0.076(1.95) 0.048(1.20) 0.039(1.00) 0.172(4.35) 0.167(4.25) 0.243(6.15) 0.238(6.05) 0.282(7.15) 0.269(6.85) 0.052(1.30) 0.044(1.10) 0.083(2.10) 0.193(4.90) 0.181(4.60) 0.053(1.35) 0.045(1.15) 0.014(0.35) 0.009(0.25) Maximum Ratings And Electrical Characteristics o (TA=25 C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum rms voltage Maximum dc blocking voltage Maximum average forward rectified current Peak forward surge current : 8.3ms single half sinewave superimposed on rated load Typical thermal resistance (Note 1) (Note 2) Operating junction temperature range Storage temperature...