SX36 Datasheet | PanJit Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-O - For surface mounted applications - Low profile package - Built-in strain relief - Metal to silicon rectifier. majority carrier conduction - Low power loss,high efficiency - High surge capacity - For use in low voltage high frequency inverters, free wheeling, and polarity protection applications - High temperature soldering guaranteed: 260°C /10 seconds at terminals .114 (2.90) .098 (2.50) .062 (1.60) .055 (1.40) .181 (4.60) .157 (4.00) .012 (.305) .006 (.152) .096 (2.44) .078 (2.00) MECHANICAL DATA Case: JEDEC DO-214AC molded plastic Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes positive end (cathode) Standard packaging: 12mm tape (EIA-481) Weight: 0.002 ounce, 0.064 gram .060 (1.52) .030 (0.76) .008(.203) .002(.051) .208 (5.28) .188 (4.80) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Resistive or inductive load. SYMBOLS SX32 20.0 14.0 20.0 SX33 30.0 21.0 30.0 SX34 40.0 28.0 40.0 SX35 50.0 35.0 50.0 3.0 SX36 60.0 42.0 60.0 SX38 80.0 56.0 80.0 SX39 UNITS 90.0 71.0 90.0 V V V A Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at T L (See figure 1) Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum Instantaneous Forward Voltage at 3.0A (Note 1) Maximum DC Reverse Current (Note 1) Ta= 25°C VRRM VRMS V DC I(AV) IFSM VF IR 0.50 80.0 0.75 0.5 20.0 0.85 A V m A m A at Rated DC Blocking Voltage Maximum Thermal Resistance(Note 2) Ta=100°C RθJL RθJA 17.0 °C/W 55.0 -50 to +150 -50 to +150 °C °C Operating and Storage Temperature Range T J Storage Temperature Range NOTES: A.Pulse Test with PW =300µsec, 2% Duty Cycle. TJ TSTG B.Mounted on P.C. Board with 14mm 2 (.013mm thick) copper pad areas. DATE : OCT.03.2002 PAGE ....