SXM36VF Datasheet | PanJit Semiconductor

Features - Ideal for automated placement - Ultra low forward voltage drop, low power loss - High efficiency operation - Low thermal resistance - Ultra thin profile package for space constrained utilization - Easy pick and place package suitable for automated handling - Lead free in pliance with EU Ro HS 2011/65/EU directive - Green molding pound as per IEC61249 Std. . (Halogen Free) Mechanical Data - Case: SMAF Molded Plastic - Terminals: Solder plated, solderable per MIL-STD-750,Method 2026 - Polarity : Color band denotes cathode end - Standard packaging : 12mm tape (EIA-481) - Weight: 0.0011 ounces, 0.0328 grams - Marking: Part number Maximum Ratings And Electrical Characteristics o (TA=25 C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum rms voltage Maximum dc blocking voltage Maximum average forward rectified current Peak forward surge current : 8.3ms single half sinewave superimposed on rated load Typical junction capacitance (VR=4V,f=1MHz) Typical thermal resistance (Note 2) (Note 1) Operating junction temperature range Storage temperature range SYMBOL VRRM VRMS VR IF(AV) IFSM CJ RθJA RθJC TJ TSTG LIMIT 60 42 60 3 80 200 150 20 -55 to +150 -55 to +150 Note : 1. Mounted on a FR4 PCB, single-sided copper, with 100cm² copper pad area. 2. Mounted on a FR4 PCB, single-sided copper, mini pad. UNIT V V V A A p F o C/W o C o C January...