UF1G Datasheet | PanJit Semiconductor

FEATURES l For surface mounted applications l Low profile package l Built-in strain relief l Easy pick and place l Ultrafast recovery times for high efficiency l Plastic package has Underwriters Laboratory Flammability Classification 94V-O l Glass passivated junction l High temperature soldering: 260 ¢J /10 seconds at terminals SMB/DO-214AA MECHANICAL DATA Case: JEDEC DO-214AA molded plastic Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Standard packaging: 12mm tape (EIA-481) Weight: 0.003 ounce, 0.093 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ¢J ambient temperature unless otherwise specified. Resistive or inductive load. For capacitive load, derate current by 20%. SYMBOLS UF1A UF1B UF1D UF1G Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 Maximum RMS Voltage VRMS 35 70 140 280 Maximum DC Blocking Voltage VDC 50 100 200 400 Maximum Average Forward Rectified Current, at TL=100 ¢J I(AV) Peak Forward Surge Current 8.3ms single half sine- IFSM 30.0 wave superimposed on rated load(JEDEC method) TA=55 ¢J Maximum Instantaneous Forward Voltage at 1.0A Maximum DC Reverse Current TA=25 ¢J At Rated DC Blocking Voltage TA=100 ¢J VF IR 1.0 1.4 10.0 100 Maximum Reverse Recovery Time (Note 1) TJ=25 ¢J TRR Typical Junction capacitance (Note 2) Maximum Thermal Resistance (Note 3) CJ R £KJL 17.0 30 Operating and Storage Temperature Range TJ,TSTG -50 to +150 NOTES: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, Irr=0.25A 2. Measured at 1 MHz and Applied reverse voltage of 4.0 volts 3. 8.0mm2 (.013mm thick) land...