UF606 Datasheet | PanJit Semiconductor

FEATURES l Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding pound l Void-free Plastic in P600 package l 6.0 ampere operation at TA=55 ¢J with no thermal runaway l l Exceeds environmental standards of MIL-S-19500/228 Ultra fast switching for high efficiency P600 MECHANICAL DATA Case: Molded plastic, P600 Terminals: Axial leads, solderable per MIL-STD-202, Method 208 Polarity: Band denotes cathode Mounting Position: Any Weight: 0.07 ounce, 2.1 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ¢J ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load UF600 UF601 Peak Reverse Voltage, Pepetitive ; VRM 50 100 Maximum RMS Voltage 35 70 DC Blocking Voltage; VR 50 100 Average Forward Current, Io @TA=55 ¢J 3.8” lead length, 60Hz, resistive or inductive load Peak Forward Surge Current IFM (surge) 8.3msec. single half sine-wave superimposed on rated load (JEDEC method) 1.00 Maximum Forward Voltage VF @6.0A, 25 ¢J Maximum Reverse Current, @ Rated TJ=25 ¢J Reverse Voltage TJ=100 ¢J Typical Junction capacitance (Note 1) CJ Typical Junction Resistance (Note 2) R £KJA Reverse Recovery Time 50 50 IF=.5A, IR=1A, Irr=.25A Operating and Storage Temperature Range UF602 200 140 200 UF604 400 280 400 6.0 300 UF606 600 420 600 UF608 800 560 800 UNITS V V V A A 1.10 10.0 1000 300 10.0 50 -55 TO +150 V £g A £g A PF ¢J /W ns ¢J NOTES: 1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC 2. Thermal resistance from junction to ambient and from junction to lead length 0.375”(9.5mm) P.C.B. mounted RATING AND CHARACTERISTIC CURVES UF600 THRU UF608 trr +0.5A 0 -0.25 NOTE:1.Rise Time = 7ns max. Input Impedance = 1 megohm. 22p F 2.Rise Time = 10ns max. Source Impedance = 50 Ohms -1.0 SET TIME BASE FOR 50 ns/cm 1cm Fig. 1-REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM AVERAGE FORWARD CURRENT, AMP 6 5 4 3 2 1 0 25...