1F3 Datasheet | PanJit Semiconductor

FEATURES l l High current capability Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing l l l l Flame Retardant Epoxy Molding pound 1.0 ampere operation at TA=55 ¢J with no thermal runaway Fast switching for high efficiency Exceeds environmental standards of MIL-S-19500/228 Low leakage R-1 MECHANICAL DATA Case: Molded plastic, R-1 Terminals: Plated axial leads, solderable per MIL-STD-202, Method 208 Polarity: Color band denotes cathode Mounting Position: Any Weight: 0.0064 ounce, 0.181 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ¢J ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. 1F1 1F2 1F3 1F4 1F5 1F6 Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current .375"(9.5mm) lead length at TA=55 ¢J Peak Forward Surge Current 8.3ms single half sine wave superimposed on rated load(JECEC method) Maximum Forward Voltage at 1.0A DC Maximum Reverse Current TJ=25 ¢J at Rated DC Blocking Voltage TJ=100 ¢J Typical Junction capacitance (Note 1) CJ Typical Thermal Resistance (Note 3) R £K JA Maximum Reverse Recovery Time(Note 2) Operating and Storage Temperature Range TJ,TSTG 50 35 50 100 70 100 200 140 200 400 280 400 1.0 30 1.3 5.0 500 600 420 600 800 560 800 UNITS 1000 V 700 V 1000 V A A V £g A £g A PF ¢J /W ns ¢J 1F7 12 67 150 150 250 -55 to +150 NOTES: 1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC 2. Reverse Recovery Test Conditions: IF=.5A, IR=1A, Irr=.25A 3. Thermal resistance from junction to ambient and from junction to lead at 0.375"(9.5mm) lead length P.C.B. mounted with 0.22×0.22"(5.5×5.5mm) copper pads RATING AND CHARACTERISTIC CURVES 1F1 THRU 1F7 trr +0.5A 0 -0.25 NOTE:1.Rise Time = 7ns max. Input Impedance = 1 megohm. 22p F 2.Rise Time = 10ns max. Source Impedance = 50 Ohms -1.0 SET...