GBJ6D Datasheet | PanJit Semiconductor

FEATURES C 0.118 (3.0) - Plastic material has Underwriters Laboratory Flammability Classification 94V-O - Ideal for printed circuit board - Reliable low cost construction utilizing molded plastic technique - Surge overload rating: 175 Amperes peak Unit: inch ( mm ) 0.996(25.3) 0.972(24.7) 0.122(3.1) 0.142(3.6) 0.189(4.8) 0.173(4.4) 0.150(3.8) 0.133(3.4) 0.146(3.7) 0.129(3.3) - High temperature soldering guaranteed: 260°C/10 seconds/.375"(9.5mm) lead length at 5 lbs. (2.3kg) tension 0.578(14.7) 0.603(15.3) MECHANICAL DATA molded plastic technique Terminals: Leads solderable per MIL-STD-202, Method 208 Mounting position: Any Mounting torque: 5 in. lb. Max. Weight: 0.15 ounce, 4.0 grams 0.087(2.2) 0.070(1.8) 0.044(1.1) 0.035(0.9) 0.304(7.7) 0.288(7.3) 0.669(17.0) 0.709(18.0) Case: Reliable low cost construction utilizing 0.115(2.9) 0.098(2.5) 0.304(7.7) 0.288(7.3) 0.304(7.7) 0.288(7.3) 0.032(0.8) 0.024(0.6) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz. For Capacitive load derate current by 20%. 0.382(9.7) 0.366(9.3) GBJ6A Maximum Recurrent Peak Reverse Voltage Maximum RMS Input Voltage Maximum DC Blocking Voltage Maximum Average Forward TC=100°C Rectified Output Current I2t Rating for fusing ( t<8.3ms) Peak Forward Surge Current single sine-wave superimposed on rated load (JEDEC method) Maximum Instantaneous Forward Voltage Drop per element at 6.0A Maximum Reverse Leakage at rated TA=25° CDc Blocking Voltage per element TC=100°C Typical Thermal Resistance per leg(Note 2) RθJA Typical Thermal Resistance per leg(Note 3) RθJC Operating and Storage Temperature Range, TJ,TSTG 50 35 50 GBJ6B 100 70 100 GBJ6D 200 140 200 GBJ6G 400 280 400 6.0 GBJ6J 600 420 600 GBJ6K 800 560 800 UNIT V V V A A2sec 127 175 1.0 5 500 8.6 3.1 -55 to +150 Apk Vpk µA µA °C / W °C / W °C NOTES: 1. Remended mounting position is to bolt down on heatsink with silicone thermal...