S3D Datasheet | PanJit Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-O - For surface mounted applications - Low profile package - Built-in strain relief - Easy pick and place - glass passivated iunction - High temperature soldering guaranteed: 260°C /10 seconds at terminals .128 (3.25) .108 (2.75) .245 (6.22) .220 (5.59) .280 (7.11) .260 (6.60) .012 (.305) .006 (.152) .008(.203) .002(.051) .320 (8.13) .305 (7.75) SMC / DO-214AB Unit: inch ( mm ) MECHANICAL DATA Case: JEDEC DO-214AB molded plastic Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Standard packaging: 16mm tape (EIA-481) Weight: 0.007 ounce, 0.21 gram .050 (1.27) .030 (0.76) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase , half wave ,60Hz, resistive or inductive load. For capacitive load , derate current by 20%. SYMBOLS S3A Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at T L = 75°C Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum Instantaneous Forward Voltage at 3.0A Maximum DC Reverse Current (Note 1) T A = 25°C at Rated DC Blocking Voltage T A =125°C IR TRR RθJL RθJA Typical Junction Capacitance(Note3) Operating and Storage Temperature Range NOTES: 1.Reverse Recovery Test Conditions:I F =0.5A,I R =1.0A,Irr=0.25A. 2.Measured at 1.0 MHZ and applied Vr=4.0 volts. 3.8.0mm 2 (.013mm thick)land areas. CJ TSTG VRRM VRMS V DC I(AV) 50 35 50 S3B 100 70 100 S3D 200 140 200 S3G 400 280 400 3.0 S3J 600 420 600 S3K 800 560 800 S3M 1000 700 1000 .103 (2.62) .079 (2.00) UNITS I FSM VF 100.0 1.20 5.0 250 2.5 13.0 47.0 53.0 -55 to +150 A V µA µA µS °C/W p F °C Typical Reverse Recovery Time(Note1) Maximum Thermal Resistance(Note 2) PAGE . 1 INSTANTANEOUS FORWARD CURRENT, AMPERES 100 40 20 10 4.0 2.0 1.0 RATING...