2SB1050
Overview
- 5 R0.9 R0.9
- 4±0.2 2.0±0.2 3.5±0.1
- 85 (Ta=25˚C) Ratings -30 -20 -7 -8 -5 1 150 -55 ~ +150 1cm2 Unit V V V A A W ˚C ˚C 1:Base 2:Collector 3:Emitter
- 5 2.5 3 2 1 Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature * Symbol VCBO VCEO VEBO ICP IC PC* Tj Tstg EIAJ:SC-71 M Type Mold Package Printed circuit board: Copper foil area of thickness of 1.7mm for the collector portion or more, and the board s Electrical Characteristics Parameter Collector cutoff current Emitter cutoff current Collector to emitter voltage Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Transition frequency Collector output capacitance (Ta=25˚C) Symbol ICBO IEBO VCEO VEBO hFE*1 VCE(sat) fT Cob Conditions VCB = -10V, IE = 0 VEB = -5V, IC = 0 IC = -1mA, IB = 0 IE = -10µA, IC = 0 VCE = -2V, IC = -2A*2 IC = -3A, IB = -0.1A*2 VCB = -6V, IE = 50mA, f = 200MHz VCB = -20V, IE = 0, f = 1MHz
- 2 min typ
- 25±0.05 s Absolute Maximum Ratings
- 55±0.1
- 45±0.05 max -100 -100
- 1±0.2 Low collector to emitter saturation voltage VCE(sat). Large collector current IC. M type package allowing easy automatic and manual insertion as well as stand-alone fixing to the printed circuit board.
- 0 4.5±0.1
