2SK0615 Datasheet PDF

FEATURES

2.0±0.2 G Low ON-resistance G High-speed switching G Allowing to be driven directly by CMOS and TTL G M type package, allowing easy automatic and manual insertion as well as stand-alone fixing to the printed circuit board. 6.9±0.1 (0.4) 2.5±0.1 (1.0) (1.0) 3.5±0.1 2.4±0.2 (1.5) (1.5) R 0.9 R 0.7 I

ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C) Parameter Drain to Source voltage Gate to Source voltage Drain current Max drain current Allowable power dissipation Channel temperature Storage temperature * Symbol VDS VGSO ID IDP PD * Tch Tstg Ratings 80 20 ±0.5 ±1 1 150 −55 to +150 Unit V V A A W °C °C 1 1.0±0.1 (0.85) 1.25±0.05 0.45±0.05 0.55±0.1 2 (2.5) 3 (2.5) 1: Source 2: Drain 3: Gate EIAJ: SC-71 M-A1 Package PC board: Copper foil of the drain portion should have a area of 1cm2 or more and the board thickness should be 1.7mm. I

ELECTRICAL CHARACTERISTICS

(Ta = 25°C) Parameter Drain to Source cut-off current Gate to Source leakage current Drain to Source breakdown voltage Gate threshold vo...