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AN17808B Datasheet Dual Audio Power Amplifier

Manufacturer: Panasonic

Overview: Panasonic Semiconductor Singapore Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 28-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. Doc Title SDSC-PSE-AN17808B Product Specifications for AN17808B Revision History Total no. of pages (excluding this page) 14 Issue Rev Eff Date S/N Page 1 2 4-NOV-04 Change Details Added this cover page. Added this page for leadfree specification. Removed this page. Amended Outer Lead Surface Process & Chip Mounting Method. Remarks 1 2 7A 7 7A 3 15-DEC-04 1 2 4 28-MAR-05 1 6 Removed physical product marking indications. FMSC-GEN-M1-01 Free Datasheet http://www.datasheet4u.com/ Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications Ref No. Total Page Page No. E 14 6 Approved Yasuo Higuchi AN17808B Package Name Unit : mm 12-SIL(FP) FP-12S ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 12 7.8 ± 0.3 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 0.6 R1.8 1 1.2 ± 0.1 +0.1 0.25 -0.05 2.54 0.6 ± 0.1 *4 Eff. Date 28-MAR-05 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 3.5 ± 0.3 29.6 ± 0.3 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications (Leadfree) Ref No. Total Page Page No.

General Description

) Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** Others ( Others ( Others ( Others ( O

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