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AN17822A Datasheet Low-frequency Amplifier

Manufacturer: Panasonic

Overview: Panasonic Semiconductor Singapore Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 2 Eff Date 28-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. Doc Title SDSC-PSE-AN17822A Product Specifications for AN17822A Revision History Total no. of pages (excluding this page) 17 Issue Rev Eff Date S/N Page 1 1 16-DEC-04 Change Details Added this cover page. Removed this page. Added this page for leadfree specification. Amended Outer Lead Surface Process & Chip Mounting Method. Remarks 1 2 3 4 7 7A 7A 2 28-MAR-05 1 6 Removed physical product marking indications. FMSC-GEN-M1-01 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications Ref No. Total Page Page No. E 17 6 Approved Yasuo Higuchi AN17822A Package Name Unit : mm 12-SIL(FP) FP-12S ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 12 7.8 ± 0.3 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 0.6 R1.8 1 1.2 ± 0.1 +0.1 0.25 -0.05 2.54 0.6 ± 0.1 Eff. Date 24-DEC-2003 Eff. Date - *2 Eff. Date Eff. Date FMSC-PSDA-002-01 REV 1 28-MAR-05 Semiconductor Company, Matsushita Electric Industrial Co., Ltd. 3.5 ± 0.3 29.6 ± 0.3 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications (Leadfree) Ref No. Total Page Page No.

General Description

) Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *1 *1 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** Others ( Others ( Others ( Others ( Others ( ) ) ) ) ) Thermalsonic bonding, A

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