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AN80T05 - Silicon Monolithic Bipolar IC

General Description

Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 3 3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi),

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Datasheet Details

Part number AN80T05
Manufacturer Panasonic
File Size 0.96 MB
Description Silicon Monolithic Bipolar IC
Datasheet download datasheet AN80T05 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Panasonic Semiconductor Singapore Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 21-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. Doc Title SDSC-PSE-AN80T05 Product Specifications for AN80T05 Revision History Total no. of pages (excluding this page) 11 Issue Rev Eff Date S/N Page 1 3 16-DEC-04 Change Details Added this cover page. Removed this page. Added this page for leadfree specification. Amended Outer Lead Surface Process & Chip Mounting Method.