Datasheet Details
| Part number | AN80T05 |
|---|---|
| Manufacturer | Panasonic |
| File Size | 0.96 MB |
| Description | Silicon Monolithic Bipolar IC |
| Datasheet | AN80T05-Panasonic.pdf |
|
|
Overview: Panasonic Semiconductor Singapore Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 21-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. Doc Title SDSC-PSE-AN80T05 Product Specifications for AN80T05 Revision History Total no. of pages (excluding this page) 11 Issue Rev Eff Date S/N Page 1 3 16-DEC-04 Change Details Added this cover page. Removed this page. Added this page for leadfree specification. Amended Outer Lead Surface Process & Chip Mounting Method. Remarks 1 2 3 4 9 9A 9A 4 21-MAR-05 1 8 Removed physical product marking indications. FMSC-GEN-M1-01 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications Ref No. Total Page Page No. E 11 8 Approved Yasuo Higuchi AN80T05 Package Name Unit : mm 12-SIL(FP) FP-12S ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 12 7.8 ± 0.3 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 0.6 R1.8 1 1.2 ± 0.1 +0.1 0.25 -0.05 2.54 0.6 ± 0.1 *4 Eff. Date 21-MAR-05 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 3.5 ± 0.3 29.6 ± 0.3 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications (Leadfree) Ref No. Total Page Page No.
| Part number | AN80T05 |
|---|---|
| Manufacturer | Panasonic |
| File Size | 0.96 MB |
| Description | Silicon Monolithic Bipolar IC |
| Datasheet | AN80T05-Panasonic.pdf |
|
|
|
) Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** Others ( Others ( Others ( Others ( Others ( ) ) ) ) ) Thermalsonic bonding, Au, Epoxy, Transfer
| Brand Logo | Part Number | Description | Manufacturer |
|---|---|---|---|
| ETC | AN80T05LF | Regulator | ETC |
| Part Number | Description |
|---|---|
| AN80T32 | Multi voltage regulator |
| AN80T53 | Multi Voltage Regulator IC |
| AN80T54 | Multi voltage regulator IC |
| AN8130FBP | High Speed Low Power Consumption Bi-CMOS 10-Bit A/D Converter |
| AN8130K | High Speed Low Power Consumption 10-Bit A/D Converter |
| AN8131FBP | High Speed Low Power Consumption Bi-CMOS 10-Bit A/D Converter |
| AN8133FHP | High Speed Low Power Consumption Bi-CMOS 10-Bit A/D Converter |
| AN8133FHQ | 10-Bit A/D Converter |
| AN8135 | High Speed Low Power Consumption Bipolar 10-Bit A/D Converter |
| AN8212K | FDD Spindle Motor Controller |