AQY221N3M
Overview
- Super miniature SON* package contributes to space savings and high density mounting. The SON type is a new PhotoMOS with approximately 43% the volume ratio of existing SSOP type. The super miniature leadless construction reduces the mounting area and enables high density mounting.
- Small Outline No-lead package Reduced to approximately 43% volume ratio Previous SSOP package (L: 2.65 × W: 4.45 × H: 1.80) (L: .104 × W: .175 × H: .071) L: 2.2 .087 H: 1.4 .055 W: 2.95 .116 New SON package Area comparison (including leads) Previous SOP4pin Previous SSOP SON 100% 44% 22%
- Both low on-resistance (R type) and low capacitance (C type) available at
- C×R10 R type: Output capacitance Typ. 14pF On resistance Typ. 0.8Ω C type: Output capacitance Typ. 1.1pF On resistance Typ.
