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C30637 - (C306xx) High Speed InGaAs PIN

Download the C30637 datasheet PDF. This datasheet also covers the C30616 variant, as both devices belong to the same (c306xx) high speed ingaas pin family and are provided as variant models within a single manufacturer datasheet.

General Description

These high-speed InGaAs photodiodes are designed for use in O E M f i b e r- o p t i c c o m m u n i c a t i o n s systems and high-speed receiver applications including trunk l i n e , L A N , f i b e r- i n - t h e - l o o p a n d data communications.

Key Features

  • 50, 75, 100, 350 µm diameters.
  • High responsivity at 1300 and 1550 nm.
  • Low capacitance for high bandwidths (to 3.5 GHz).
  • Available in various packages www. perkinelmer. com/opto C30616, C30637, C30617, C30618 Specifications (at V R =V op typical), 22˚ C.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (C30616_PerkinElmerOptoelectronics.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number C30637
Manufacturer Perkin Elmer Optoelectronics
File Size 646.63 KB
Description (C306xx) High Speed InGaAs PIN
Datasheet download datasheet C30637 Datasheet

📁 Similar Datasheet

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Other Datasheets by Perkin Elmer Optoelectronics

Part Number Description
C30637 (C306xx) High Speed InGaAs PIN Photodiodes
C30616 (C306xx) High Speed InGaAs PIN
C30616 (C306xx) High Speed InGaAs PIN Photodiodes
C30617 (C306xx) High Speed InGaAs PIN
C30617 (C306xx) High Speed InGaAs PIN Photodiodes

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
D A T A S H E E T Lighting Imaging Telecom InGaAs PIN Photodiodes High-Speed InGaAs PIN C30616, C30637, C30617, C30618 InGaAs PIN Photodiodes Description These high-speed InGaAs photodiodes are designed for use in O E M f i b e r- o p t i c c o m m u n i c a t i o n s systems and high-speed receiver applications including trunk l i n e , L A N , f i b e r- i n - t h e - l o o p a n d data communications. Ceramic submount packages are available for easy integration into highs p e e d S O N E T, F D D I , d a t a l i n k receiver modules, or as backfacet power monitors in laser d i o d e m o d u l e s .