Click to expand full text
.025" NPN Phototransistors
IRT Molded Lensed Lateral Package
VTT7222, 7223, 7225
PACKAGE DIMENSIONS inch (mm)
CASE 7 LATERAL CHIP TYPE: 25T
PRODUCT DESCRIPTION
A small area high speed NPN silicon phototransistor mounted in a 3 mm diameter, lensed, end looking, plastic package. The package material transmits infrared and blocks visible light. These devices are spectrally and mechanically matched to the VTE717x series of IREDs.
ABSOLUTE MAXIMUM RATINGS
(@ 25°C unless otherwise noted)
Maximum Temperatures Storage Temperature: Operating Temperature: Continuous Power Dissipation: Derate above 30°C: Maximum Current: Lead Soldering Temperature: (1.6 mm from case, 5 sec. max.)
-40°C to 85°C -40°C to 85°C 50 mW 0.
VTT7222 Datasheet
