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BGB203 Datasheet Bluetooth System In Package Radio

Manufacturer: Philips Semiconductors (now NXP Semiconductors)

Overview: .. BGB203 Bluetooth System-in-a-Package radio with baseband controller Rev. 1.0 — 2005 July 28 Product Shortform Datasheet 1.

General Description

The BGB203 bines the Bluetooth RF part, protocol stack, Link Controller (LC), Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth system specification in one SiP with embedded software.

Together with an antenna and a reference clock this device forms a plete Bluetooth solution.

In most cases this SiP will be attached to a host, for example a GSM baseband controller or a PC processor.

Key Features

  • 2.1 General.
  • Plug-and-play Bluetooth class 1 System-in-a-Package (SiP) Includes all baseband and radio functionality, from HCI up to antenna, needs only external antenna and reference clock. Fully compliant to Bluetooth Radio Specification version 1.2. Small dimensions (7 x 8 x 1.3 mm typical) in HVQFN like package with full BGB204 HVQFN compatible footprint Fully integrated near-zero-IF receiver with high sensitivity (typical -88 dBm at antenna input) Digital demodulator.

More Datasheets from Philips Semiconductors (now NXP Semiconductors)

Part Number Description

BGB203 Distributor