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SAA4977H Datasheet Besic

Manufacturer: Philips Semiconductors (now NXP Semiconductors)

Overview: INTEGRATED CIRCUITS DATA SHEET SAA4977H Besic Preliminary specification File under Integrated Circuits, IC02 1998 Jul 23 Philips Semiconductors Besic CONTENTS.

General Description

3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING INFORMATION 6.1 Pinning 6.2 Pin description 7 FUNCTIONAL DESCRIPTION 7.1 Analog-to-digital conversion 7.2 Digital processing at 1fH level 7.3 Digital processing at 2fH level 7.4 Digital-to-analog conversion 7.5 Microprocessor 7.6 Memory controller 7.7 Line locked clock generation 7.8 Clock and sync interfacing 7.9 4 : 1 : 1 I/O interfacing 7.10 Test mode operation 7.11 I2C-bus control registers 8 LIMITING VALUES 9 THERMAL CHARACTERISTICS 10 CHARACTERISTICS 11 APPLICATION 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction 13.2 Reflow soldering 13.3 Wave soldering 13.4 Repairing soldered joints 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS 16 PURCHASE OF PHILIPS I2C COMPONENTS Preliminary specific

Key Features

  • 2.

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