Power Innovations Limited TIPP32C
PNP SILICON POWER TRANSISTORS
MECHANICAL DATA
LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LP003 (TO-92) 5,21 4,44 3,43 MIN. 2,67 2,03 4,19 3,17 2,67 2,03 LP003 Falls Within JEDEC TO-226AA Dimensions Seating Plane 5,34 4,32 1,27 (see Note A) 12,7 MIN. 0,56 0,40 1 3 1,40 1,14 2,67 2,41 2 0,41 0,35 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTE A: Lead dimensions are not controlled in this area. MDXXAX PRODUCT INFORMATION 3 TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997MECHANICAL DATA
LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound.