TOP253EN
Overview
- Multi-mode operation maximizes efficiency at all loads
- New eSIP-7F and eSIP-7C packages
- Low thermal impedance junction-to-case (2 °C per watt)
- Low height is ideal for adapters where space is limited
- Simple mounting using a clip to aid low cost manufacturing
- Horizontal eSIP-7F package ideal for ultra low height adapter and monitor applications
- Extended package creepage distance from DRAIN pin to adjacent pin and to heat sink
- No heat sink required up to 35 W using P, G and M packages with universal input voltage and up to 48 W at 230 VAC
- Output overvoltage protection (OVP) is user programmable for latching/non-latching shutdown with fast AC reset
- Allows both primary and secondary sensing
