PS21265-P
Overview
DIP-IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 5th generation CSTBT Chip Technology, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.
- 3.11±0.02 79.0±0.5 E 2.64±0.015 67.0±0.3 F 0.79±0.01 20.0±0.3 G 0.4±0.015 10.0±0.3 H 0.11±0.015 2.8±0.3 J 0.18±0.01 Dia. 4.5±0.2 Dia. K 1.37±0.02 34.9±0.5 L 0.53±0.02 13.4±0.5 M 0.84±0.02 21.4±0.5 N 1.10±0.02 28.0±0.5 P 0.45 11.5 Q 0.33 8.5 R 0.15±0.01 3.8±0.2 Dimensions S T U V
