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QID3310006 - Dual IGBT HVIGBT Module

General Description

Powerex HVIGBTs feature highly insulating housings that offer enhanced protection by means of greater creepage and strike clearance distance for many demanding applications like medium voltage drives and auxiliary traction applications.

Key Features

  •  -40 to 150°C Extended  Temperature Range  100% Dynamic Tested  100% Partial Discharge Tested  Advanced Mitsubishi R-Series Chip Technology  Aluminum Nitride (AlN) Ceramic Substrate for Low Thermal Impedance  Complementary Line-up in Expanding Current Ranges to Mitsubishi HVIGBT Power Modules  Copper Baseplate  Creepage and Clearance Meet IEC 60077-1  Rugged SWSOA and RRSOA.

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Other Datasheets by Powerex, Inc

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QID3320002 Dual IGBT HVIGBT Module
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QID3330001 Dual IGBT HVIGBT Module
QID3340001 Dual IGBT HVIGBT Module
QID3350001 Dual IGBT HVIGBT Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com QID3310006 Preliminary Dual IGBT HVIGBT Module 100 Amperes/3300 Volts S NUTS (3TYP) A D FF J (2TYP) C 78 56 BE M 1 G (3TYP) T (SCREWING DEPTH - 3 TYP) 23 H H 4 R (DEEP) K (3TYP) L (2TYP) V (4TYP) U (5TYP) P Q N 42 8 7 1 5 63 Outline Drawing and Circuit Diagram Dimensions Inches Millimeters A 5.51 140.0 B 2.87 73.0 C 1.50 38.0 D 4.88±0.01 124.0±0.25 E 2.24±0.01 57.0±0.25 F 1.18 30.0 G 0.43 11.0 H 1.07 27.15 J 0.20 5.0 K 1.65 42.0 Dimensions L M N P Q R S T U V Inches 0.69±0.01 0.38 0.20 0.22 1.04 0.16 M5 Metric 0.63 Min. 0.11 x 0.02 0.28 Dia. Millimeters 17.5±0.25 9.75 5.0 5.5 26.5 4.0 M5 16.0 Min. 2.8 x 0.5 7.0 Dia.