PSKT26
Overview
- (dv/dt)cr PGM PGAV VRGM TVJ TVJM Tstg VISOL Md Weight W W W V °C °C °C V~ V~ * * *
- International standard package, JEDEC TO-240 AA Direct copper bonded Al2O3 -ceramic base plate Planar passivated chips Isolation voltage 3600 V~ UL registered, E 148688 Gate-cathode twin pins for version 1
