Datasheet Summary
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones ✔ I/O Ports ✔ Notebooks & Pocket PCs ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART Cards
IEC PATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air
- 15kV, Contact
- 8kV ✔ 61000-4-4 (EFT): 40A
- 5/50ns
5 BUMP FLIP CHIP
Features
✔ ESD Protection > 25 kilovolts ✔ Unidirectional Configuration ✔ Low Capacitance: 15pF ✔ Protects Up to Four(4) Data Lines ✔ RoHS pliant
MECHANICAL CHARACTERISTICS
✔ 5 Bump Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free
- Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for...
